Joint call with Korea on Heterogeneous integration and neuromorphic computing technologies for future semiconductor components and systems.


  • Call identifier Chips 2024-2-RIA-T3
  • Call Open (FPP) 6 February 2024
  • Call Closed 17 September 2024 (17:00:00 GMT+1)

  • Maximum JU Expenditure (M€) 6.00


  • This call is closed.



  • The Non-Initiative Calls will be two-stage calls with submission of Project Outline (PO) and Full Project Proposal (FPP).


    • Call Info


      MAWP Appendix 3
      Click here



      Additional Info

        MAWP 2023-2027

        Discover details about the MAWP.

        Click here

        SRIA Introduction

        An introduction and overview of SRIA.

        Click here

        Q & A

        Have Questions? Submit the question to us!

        Click here