17 December 2024 - The Pilot Line on Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS) is ready to fly. This initiative is a core element of the EU Chips Act and will be supported by €730 million in funding, contributed by the Chips JU and the national funding authorities of the Participating States. 

The APECS Consortium brings together ten members from eight European countries: Germany (Fraunhofer-Gesellschaft as coordinator, FBH, IHP), Austria (TU Graz), Finland (VTT), Belgium (imec), France (CEA-Leti), Greece (FORTH), Spain (IMB-CNM, CSIC) and Portugal (INL). APECS is coordinated by the Fraunhofer-Gesellschaft and implemented by the Research Fab Microelectronics Germany (FMD).

This pilot line will address critical challenges in microelectronics, enabling the development of next-generation solutions that enhance performance, scalability, and sustainability across a range of applications. The focus on emerging chiplet technologies will facilitate the creation of robust and trusted heterogeneous systems, significantly boosting the innovation capacity of the European semiconductor industry. 

Aditionally, APECS will be accessible to a wide range of stakeholders, including universities, RTOs, SMEs, and industrial companies across the EU, as well as to like-minded countries. By bridging application-oriented research with state-of-the-art innovations in heterogeneous integration, APECS will enhance Europe’s semiconductor innovation capacity and strengthen its position in the global market.

The Chips Joint Undertaking (Chips JU) has signed the Hosting Agreement (HA) and the Joint Procurement Agreements (JPA), which are essential to initiate the procurement process for the pilot line implementation. 

Press release from the German Federal Ministry of Education and Research : 
https://www.bmbf.de/SharedDocs/Pressemitteilungen/DE/2024/12/161224-ChipsAct.html

Press release from APECS: 
https://www.apecs.eu/en/news-and-events/press-release.html

APECS website: 
https://www.apecs.eu/ 

About Chips Joint Undertaking:

Chips Joint Undertaking supports research, development, innovation, and capacity building in the European semiconductor ecosystem. Launched by the European Union Council Regulation No 2021/1085 and amended in September 2023 via Council Regulation 2023/1782, it contributes to reinforce the competitiveness and resilience of the semiconductor technological and industrial base, engaging a significant EU, national/regional and private industry funding of nearly €11 billion. The Chips JU is funded by the European Union, Chips JU Participating States and the Private Members.

Media Contacts:
Chips Joint Undertaking 
communication@chips-ju.europa.eu
Luciano.Gaudio@chips-ju.europa.eu