Initiative Calls 2023

Chips JU


Pilot Lines Calls

Chips 2023-CPL-1

Chips 2023-CPL-2

Chips 2023-CPL-3

Chips 2023-CPL-4

Advanced sub 2nm leading-edge system on chip technology

Advanced Fully Depleted Silicon On Insulator technologies targeting 7nm

Advanced Packaging and Heterogenous Integration

Advanced semiconductor devices based on Wide Bandgap materials


Total

700.00

420.00

370.00

180.00


1,670.00



Deadlines
The Pilot Lines Calls will be single-stage calls with submission of Full Project Proposal (FPP)
  • Opening date: 1st February 2024
  • Deadline (FPP proposals): at 17:00:00 Brussels time on 29 February 2024




Q & A
Explore our Q&A section by clicking below. This document compiles answers to frequently asked questions, offering insights and information.





Proposal Submission

Please note that an applicant consortium shall submit one application with three interrelated proposals to apply to any of the above mentioned calls. More details are provided in the Work Programme 2023-2027.




Each Call for Pilot Line includes three interrelated calls::
  • Call for Expression of Interest (CfEoI) for the selection of a Hosting Consortium
  • Call for proposals for Set-up, integration and process development, funded under the Horizon Europe (HE) Programme
  • Call for proposals for the operational activities of the pilot line, funded under the Digital Europe Programme (DEP).



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