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MAWP 2023-2027

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Our Projects

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Empowering Europe's Semiconductor Industry.

Chips Joint Undertaking (Chips JU) aims to bolster Europe's semiconductor industry by fostering collaboration between the EU, member states, and private sector.

Focused on research, innovation, and manufacturing, Chips JU seeks to position Europe as a leader in semiconductor technology, enhance digital capacity, and address global challenges such as sustainability.

The initiative aligns with European policy goals to ensure the continent's technological and industrial leadership.

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Trending Now
Feb
24
2025
Strengthening collaboration for semiconductor innovation The Electronic Components and Systems (ECS) Brokerage Event 2025, held on 18 and 19 February at Hotel Le Plaza in Brussels, brought together key stakeholders from the European semiconductor ecosystem.
Jan
17
2025
European Commission hosts a Ceremonial Event for the launch of Chips JU Pilot Lines The European Commission hosted a signature ceremony for the Chips JU pilot lines, marking the formalisation of the groundbreaking €3.7 billion investment from the European Union and Participating States to strengthen capacity building and innovation in Europe.




Events on the Horizon.
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Semiconductors: Opportunities and Challenges 17/03/2025
17/03/2025
Braga, Portugal On the 17th of March, the event “Semiconductors: Opportunities and Challenges” takes place at the International Iberian Nanotechnology Laboratory (INL), in Braga. This event will bring together members of the Portuguese Government, key decision-makers, industry leaders, and researchers to share the strategies and initiatives from different geographies and to discuss the opportunities and challenges associated with the semiconductor sector in the country, at regional level, within the EU, and at Registration
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FAMES Pilot Line Open Call 18/03/2025
18/03/2025
Brussels, Belgium The FAMES Pilot Line provides chipmakers, startups, fabless companies and academics with a pathway to high-performance, low-power chips. Find out how to access, explore and train on advanced FD-SOI technologies, embedded non-volatile memories, 3D integration, RF components, and power management integrated circuit solutions. Registration


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Vacancies

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