Chips For Europe
The Chips for Europe Initiative supports technological capacity building and innovation in the Union. The initiative includes pilot lines on sub-10nm low-power transistor technologies, leading-edge node technologies below 2nm, heterogeneous system integration, advanced photonic integrated circuits, and wide band-gap materials. It also supports pilot lines for integrated photonic technologies and fully depleted silicon-on-insulator (FD-SOI) technologies, with dedicated efforts on quantum chips. In addition, the Initiative establishes a large-scale design platform to facilitate research, development, test, experimentation and validation of new technologies, and a network of competence centres across Member States to provide training, expertise, and access to infrastructure for industry and academia. These new infrastructures will be open to EU players, large or small, industry or researchers, designers or SMEs, from various vertical sectors. Such users are central to the Initiative.
Open Calls
Accelerator for Advanced Strained Silicon on Insulator Substrates
DIGITAL-JU-Chips-2025-SG-SSOI
Click hereComing Soon Calls
Lab to Fab Accelerators (The specified dates are mere estimations)
DIGITAL-JU-Chips-2025-LFA-IA
Click hereClosed Calls
Quantum Chip Technology
HORIZON-JU-CHIPS-2025-QAC-SGA
Click hereLow-power Edge AI Chips
DIGITAL-JU-Chips-2025-IA-LEAI
Click hereOpen-source EDA tools development (second phase)
HORIZON-JU-Chips-2025-IA-EDA
Click hereSet-up and integration of Design Enablement Teams
DIGITAL-JU-Chips-2025-CSA-DET
Click hereA Pan-European infrastructure for Chips Design Innovation
HORIZON-JU-Chips-2025-CSA
Click hereOpen-source EDA tools development (first phase)
HORIZON-JU-Chips-2025-IA-EDA
Click hereCompetence Centres
CHIPS-2024-SG-CCC-3
Click hereQuantum Chip Technology for High-Quality Trapped Ions
Chips-2024-QAC-2
Click hereQuantum Chip Technology for stability
Chips-2024-QAC-1
Click hereCompetence Centres
Chips-2024-CCC-1
Click hereSupport to the European Network of Chips Competence Centres
Chips-2024-CCC-2
Click herePilot Line on Advanced Photonic Integrated Circuits
Chips-2024-CPL-5
Click hereDesign Platform
Chips-2024-CDP-1
Click herePilot line on Advanced Fully Depleted Silicon On Insulator technologies targeting 7nm
Chips-2023-CPL-2
Click herePilot line on Advanced Packaging and Heterogenous Integration
Chips-2023-CPL-3
Click herePilot line on Advanced sub 2nm leading-edge system on chip technology
Chips-2023-CPL-1
Click herePilot line on Advanced semiconductor devices based on Wide Bandgap materials
Chips-2023-CPL-4
Click here