Chips For Europe


The Chips for Europe Initiative supports technological capacity building and innovation in the Union. It supports the development of new pilot lines that build on the experiences of the ECSEL Joint Undertaking and the Photonics Public-Private Partnership. The initiative will include pilot lines on sub-10nm low-power transistor technologies, leading-edge node technologies below 2nm, heterogeneous system integration, and wide band-gap materials. It also encompasses a call for a pilot line on integrated photonic technologies, with additional calls for quantum chips as part of the initiative's ongoing efforts. The creation of large-scale infrastructures such as a design platform to facilitate research, development, test, experimentation and validation of new technologies also form part of the Initative. These new infrastructures will be open to EU players, large or small, industry or researchers, designers or SMEs, from various vertical sectors. Such users are central to the Initiative.




Open Calls


Competence Centres

CHIPS-2024-SG-CCC-3

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Coming Soon Calls


Open-source EDA tools development

HORIZON-JU-Chips-2025-IA-EDA

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Close Calls


Quantum Chip Technology for High-Quality Trapped Ions

Chips-2024-QAC-2

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Quantum Chip Technology for stability

Chips-2024-QAC-1

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Competence Centres

Chips-2024-CCC-1

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Support to the European Network of Chips Competence Centres

Chips-2024-CCC-2

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Pilot Line on Advanced Photonic Integrated Circuits

Chips-2024-CPL-5

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Design Platform

Chips-2024-CDP-1

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Pilot line on Advanced Fully Depleted Silicon On Insulator technologies targeting 7nm

Chips-2023-CPL-2

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Pilot line on Advanced Packaging and Heterogenous Integration

Chips-2023-CPL-3

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Pilot line on Advanced sub 2nm leading-edge system on chip technology

Chips-2023-CPL-1

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Pilot line on Advanced semiconductor devices based on Wide Bandgap materials

Chips-2023-CPL-4

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