The Chips JU is currently preparing the launch of two calls for Advanced Packaging. The draft call document can be found here.

This workshop, arranged with and hosted by the EMPC 2025 | The 25th European Microelectronics & Packaging Conference (EMPC 2025), aims to inform the community about the call content and to initiate consortia building. 

The workshop will take place on site only. Register here.

If you are not able to join the workshop, but you are interested in the calls and funding opportunities, please do not hesitate to contact the EPoSS Office via contact@smart-systems-integration.org.

Chips JU is preparing the launch of two calls in this field, and the workshop offers an opportunity to learn more about the upcoming topics and to start building consortia. The draft call, published on 2 September 2025, can be found here.