Pilot line on Advanced Packaging and Heterogenous Integration

Call Details

This pilot line focuses on developing 2.5D and 3D heterogeneous integration technologies to combine chiplets from different domains into efficient systems-in-package.

About this Call

• Type of Action: Research and Innovation Action (RIA); Simple Grant
• Indicative EU budget: Max. €370 Million
• Indicative National Budgets
• Expected EU contribution per project:Up to €370 Million (One selected project)
• Mode: Call for Pilot Line (CPL)
• Stage: One-stage (FPP only)
• Opening date: 30 November 2023
• Closing date: 28 February 2024
• Publication Date: 30 November 2023

Call Documents

General Call Documents

• Chips JU Multiannual Work Programme

• PAB decision on the evaluation and selection procedures related to Calls for Proposals

• Rules for legal entity validation, LEAR appointment, financial capacity and ownership control assessment

• Annotated Model Grant Agreement for EU Funding Programmes 2021-2027

Specific Call Documents

• Call documents Chips-2023-CPL-DEP-1-4 (Zip file)

• Call documents Chips-2023-CPL-HE-1-4 (Zip file)