Pilot line on Advanced semiconductor devices based on Wide Bandgap materials

Call Details

This call seeks to extend the maturity of SiC and GaN technologies and explore new wide bandgap materials to support high-efficiency power and radio frequency electronics.

About this Call

• Type of Action: Research and Innovation Action (RIA); Simple Grant
• Indicative EU budget: Max. €180 Million
• Indicative National Budgets
• Expected EU contribution per project:Up to €180 Million (One selected project)
• Mode: Call for Pilot Line (CPL)
• Stage: One-stage (FPP only)
• Opening date: 30 November 2023
• Closing date: 28 February 2024
• Publication Date: 30 November 2023

Call Documents

General Call Documents

• Chips JU Multiannual Work Programme

• PAB decision on the evaluation and selection procedures related to Calls for Proposals

• Rules for legal entity validation, LEAR appointment, financial capacity and ownership control assessment

• Annotated Model Grant Agreement for EU Funding Programmes 2021-2027

Specific Call Documents

• Call documents Chips-2023-CPL-DEP-1-4 (Zip file)

• Call documents Chips-2023-CPL-HE-1-4 (Zip file)