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Recap of EFECS 2024: Strengthening EU Competitiveness to connect with leaders and innovators driving
The European Forum for Electronic Components and Systems (EFECS) 2024, held on December 5-6, brought together more than 700 participants,
APECS marks a milestone for the European semiconductor industry
The Pilot Line on Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS) is ready to fly.
Dr Stefan Finkbeiner appointed as the new Chair of the Chips Joint Undertaking Governing Board
Dr Stefan Finkbeiner has been elected as the new Chair of the Chips Joint Undertaking (Chips JU) Governing Board (GB), succeeding Dipl. -Ing. Ralf Bornefeld.
Chips JU entered negotiations to fund a Pilot Line for Advanced Photonic Integrated Circuits
The Public Authorities Board (PAB) of the Chips Joint Undertaking (Chips JU) has selected the consortium with which to start negotiations to establish a new Advanced Photonic Integrated Circuits (PIC) Pilot Line in Europe
Calls for proposals in quantum chip technology
The Chips Joint Undertaking (Chips JU) has launched two calls for quantum chips technologies, with a total Invesment of €65 million, as part of the Chips for Europe Initiative.
Chips JU and Republic of Korea Initiate Semiconductor Collaboration
The Chips Joint Undertaking is thrilled to announce a strategic collaboration with the European Union and the Republic of Korea to advance semiconductor research, development, and innovation. This partnership aims to foster technological advancements, enhance supply chain resilience, and secure a leading position in the global semiconductor industry.
