First APECS Open Access Call started

Since 1 April, the first annual APECS Open Access Call is open to applications from stakeholders across the entire semiconductor ecosystem, including large companies, RTOs, universities, and in particular SMEs as well as start-ups.

The Calls provide structured, guided, and transparent access to APECS’ modern R&D infrastructure, enabling companies, RTOs and universities to validate concepts, accelerate development, and collaborate directly with APECS experts. The goal is to lower barriers to advanced semiconductor R&D infrastructure and foster innovation in Europe’s chip landscape.

Selected projects benefit from:

• Direct access to state-of-the-art pilot line infrastructure

• First-hand collaboration with technology experts

• Faster validation and prototyping of new semiconductor concepts

• Lower barriers to advanced semiconductor technologies
   

This first Call offers access to four technology fields:

• Characterization, test, reliability (CTR)

• Multi Project Wafer (MPW) Runs

• Integration & Packaging Technologies

• Imaging Technologies, Post-CMOS Photonic Platform & IPD planar components
   

Until 30 June, proposals can be submitted via the APECS website. Discover more about the Open Access call here.

The Open Access Calls are a core component of APECS’ broader access strategy. Complementing them, the One-Stop-Shop (OSSO) of the Research Fab Microelectronics Germany (FMD) serves as a central pillar of APECS’ outreach to its user community. As a core element of APECS, the OSSO provides industry customers with a single, central entry point for initial engagement across the pilot line, while integrating the expertise of all European partners involved in APECS. Through this approach, APECS ensures fair and straightforward access to its pilot line technologies. Potential customers can submit inquiries via a contact form on the APECS website.