Open & Upcoming Calls

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Welcome to the Chips Joint Undertaking (JU) funding opportunities page, a central hub for organisations looking to participate in the strategic advancement of the European semiconductor ecosystem. The Chips JU manages two primary pillars of investment, supported by funding from the Horizon Europe and Digital Europe programmes:

The Chips for Europe Initiative: Bridges the gap between research and industrial deployment. It funds strategic actions such as the establishment of Pilot Lines, the development of a cloud-based Design Platform, the creation of Competence Centres to provide essential expertise and skills across Europe, and dedicated Quantum actions to accelerate the development of European quantum technologies.

The Electronics Components and Systems Research and Innovation (ECS R&I): Supports collaborative projects across a broad spectrum of technological domains. Key focus areas include AI hardware, edge computing, cybersecurity, 6G technologies, energy efficiency, advanced packaging, and photonics.

Participation and Funding

Our calls accommodate diverse project needs (one-stage or two-stage). Projects may be co-funded by National Authorities or supported exclusively through EU funding.

How to Apply

See the list of open and upcoming calls below. Click on a specific call details page for guidance on proposal submission, technical requirements, and eligibility.

Finding Partners

Building a consortium is vital. Use the ECS Collaboration Tool to connect with expert partners across the European ECS value chain.

Open calls

RIA “Resilience”: Call on the 6G Front End Module

Topic code: HORIZON-JU-Chips-2026-2-RIA

Targets the design and implementation of integrated microelectronic building blocks for 6G radio communication Front End Modules.

Opening Date: 07-07-2026 | Closing Date: 16-09-2026 | Time left:

Indicative EU Budget: 20 M€

Open
ECS
HE

ECS International collaboration - Call with Digital Partnership and TTC countries

Topic code: HORIZON-JU-Chips-2026-3-RIA

Fosters low-TRL collaboration with India, Singapore, and Taiwan on chip design, manufacturing, and packaging. No co-financing by Chips JU Participating States following Article 141(2) SBA (100% HE funding).

Opening Date: 07-07-2026 | Closing Date: 16-09-2026 | Time left:

Indicative EU Budget: 5 M€

Open
ECS
HE

ECS Supply chain resilience CSA

Topic code: HORIZON-JU-CHIPS-2026-2-CSA

Aims to enhance resilience by developing a "digital twin" data platform for monitoring disruptions and stress tests. No co-financing by Chips JU Participating States following Article 141(2) SBA (100% HE funding).

Opening Date: 07-07-2026 | Closing Date: 22-09-2026 | Time left:

Indicative EU Budget: 2 M€

Open
ECS
HE

Preparing a European autonomous driving stack ecosystem building on next-generation SDV software and hardware computing architectures

Topic code: HORIZON-JU-CHIPS-2026-SDV-CSA

Coordinates European vehicle initiatives to establish an open reference architecture and sustainable roadmap.

Opening Date: 07-07-2026 | Closing Date: 22-09-2026 | Time left:

Indicative EU Budget: 2 M€

Open
ECS
HE

AI chip demonstrators for EU compute infrastructure

Topic code: DIGITAL-JU-CHIPS-2026-AI1-SG

First call of Stream A in the AI chips and systems for EU compute infrastructure initiative, aiming at AI chip demonstrators to support cutting-edge European chip designers to showcase operational silicon hardware ready for infrastructure integration.

Opening Date: 07-07-2026 | Closing Date: 23-09-2026 | Time left:

Indicative EU Budget: 10 M€

Open
Chips for Europe
DEP

Upcoming calls

No calls are currently planned; please check back on this page for future updates.