IC-Link DET

IC-Link DET proposal addresses critical barriers faced by European SMEs and startups in adopting advanced semiconductor technologies. By establishing a robust, secure, and fully cloud-based semiconductor design enablement platform, IC-Link will provide frictionless access to validated design flows, and comprehensive PDKs from multiple commercial foundries and European pilot lines. IC-Link holds a unique position as Europe's sole TSMC Value-Chain Aggregator (VCA), with established partnerships including UMC, XFAB and Silterra, and a proven track record of delivering 450+ successful tape-outs annually across multiple technologies and more than 40 digital and mixed-signal design projects completed in 2023–2024 alone. The initiative adopts a two-tracks implementation strategy: first, immediate delivery and support to SMEs and startups with our exiting capabilities, and second, developing a scalable, fully cloud-based infrastructure to support long-term growth and secure virtual access. Offering seamless access to CMOS bulk, FinFET, and silicon photonics processes, along with dedicated support and application engineering including, integrated packaging and testing services, and streamlined supply-chain management, IC-Link DET strengthen Europe’s semiconductor resilience, enhances digital sovereignty, and empowers European innovators to compete globally in markets including AI, high-performance computing, automotive, telecommunications, medical, industrial, and aerospace. Through this DET application, IC-Link aims to broaden Europe’s semiconductor design capabilities, shorten time-to-tapeout, and ensure trusted access to large foundry ecosystems, all while aligning with the strategic objectives of the European Chips Act.