SUPREME 1

SUPREME will develop scalable baseline processes for superconducting quantum devices and provide European SMEs, start-ups, academia, RTOs and large enterprises with access to the processes. SUPREME will implement the first 3,5 years of an ambitious roadmap for the industrialisation of superconducting quantum technologies. SUPREME harnesses top European expertise to develop key quantum processes: angle-evaporated junctions, etched junctions, 3D integration and hybrid processes for applications in quantum computing, quantum sensing and quantum communication. The performance of the processes will be ensured through rigorous testing and quality assurance methodologies. SUPREME will reach technology readiness level (TRL) 6 and manufacturing readiness level (MRL) 6. A 3D integrated qubit module with 200 qubits will be demonstrated, validating the improvements in stability, yield, and reproducibility of the key processes for superconducting quantum chips. To maximise impact, SUPREME will commercialize its baseline processes via piloting services, enabling product business by companies, and prepare for technology transfers to volume manufacturing. An early industrialization roadmap will be prepared to pave the way for wide industrialization of the offering. Access to the technologies will be given through PDKs and pilot runs that will enable users to design the devices based on SUPREME processes. SUPREME Service Office will enable a smooth customer experience. SUPREME will foster innovation network building by collaborating with European quantum initiatives and ecosystems. SUPREME strengthens Europe’s position in quantum technology and builds the basis for European technology sovereignty for superconducting quantum technologies. A European pilot enables European companies to innovate and develop IP in Europe, building a basis for long term economic growth. SUPREME significantly contributes to goals of the European Quantum and the European Chips Act.