CHASSIS

The CHASSIS (Chiplet-based Hardware Architectures for Software-defined Vehicles) project aims to transform the automotive and semiconductor industries by establishing a flexible, open, and collaborative ecosystem for chiplet-based System-on-Chips (SoCs). This initiative supports the development of next-generation vehicles focused on electrification, connectivity, and autonomy while strengthening Europe’s position in the global semiconductor market and reducing reliance on non-European suppliers. CHASSIS seeks to create a sustainable, interoperable platform for automotive applications, fostering innovation, competitiveness, and strategic autonomy in semiconductor manufacturing. The project spans the entire lifecycle of chiplet-based SoCs, from requirements definition and architecture design to hardware/software co-development, system integration, and validation. By bringing together industrial semiconductor partners, European OEMs, and leading RTOs, CHASSIS aims to develop multi-vendor chiplet-based SoCs for high-performance computing (HPC) automotive applications. This collaborative approach ensures seamless integration, openness, and multi-vendor compatibility, while leveraging outcomes from imec’s Automotive Chiplet Program (ACP) and aligning with other European initiatives like EU RISC-V and HAL4SDV. CHASSIS will deliver substantial benefits, including: - Industrial Competitiveness - Economic Growth - Advancing Research - Sustainability - Policy Alignment Ultimately, CHASSIS aims to establish Europe as a global leader in chiplet-based SoC technologies, driving innovation, creating jobs, and ensuring a resilient semiconductor supply chain. Its scalable, modular, and secure framework for Software-Defined Vehicles (SDVs) will benefit automotive OEMs, Tier-1 suppliers, and the semiconductor industry, with broader impacts across sectors like aerospace, robotics, and industrial automation.