VUO-IC

VUO-IC delivers a fully operational European service for semiconductor design enablement, lowering the threshold for innovators across all Member States to access advanced design flows, expert support, and prototyping capabilities. Designed to serve startups, SMEs, and research teams, VUO-IC facilitates design projects in Bulk CMOS: digital SoC, mixed-signal, RF & cryo-CMOS and in "More-than-Moore" domain: RF/mmWave, quantum, and photonics, enabling Europe’s next wave of deep-tech innovation. The service builds on field-proven infrastructure and workflows. Tampere University anchors secure on-premises EDA flows validated in industrial settings. CoreHW and VLSI Solution provide commercial-grade digital and mixed-signal design, IP reuse and test & packaging services. VTT offers direct access to cleanroom fabrication, pilot line platforms, and full-stack support in high-frequency, quantum, cryo-CMOS and photonic technologies. Coordination, user intake, and stakeholder engagement are handled by Tamlink using trusted models already deployed under Finland’s Chips Competence Centre (FiCCC) and European Network of Chip Competence Centres (ENCCC). VUO-IC supports early onboarding through validated local environments and scales up via EuroCDP cloud integration. Users benefit from end-to-end support: from application engineering to MPW tape-out, OSAT handoff, and bring-up. VUO-IC addresses a critical gap in the European semiconductor landscape: providing agile, scalable design enablement for low- and mid-volume innovators not served by traditional industry. It strengthens Europe’s competitiveness and resilience by enabling more actors to move from concept to silicon - Supporting strategic sectors such as smart mobility, robotics & industrial, telecom, healthtech, quantum R&D infrastructure and space. With roots in Nordic engineering and reach across the EU, VUO-IC combines operational readiness with long-term sovereignty impact.