The next-generation of silicon-based power solutions in mobility, industry and grid for sustainable decarbonisation in the next decade.

The global energy demand is constantly growing. There is the strong need to increase the usage of renewables to reduce carbon emissions. The most potent leverage here is pushing electrification in industry, mobility and grid. This increases the demand for efficient power semiconductors, which are used wherever electrical power is generated, transmitted or consumed. Power2Power fosters a holistic, digitised pilot line approach in the Power Electronic Components and Systems (ECS) domain by accelerating the transition of ideas to innovations. The digitised pilot line approach along the complete supply chain located entirely in Europe will strengthen the international leadership of European industry through working together with multiple organizations, combining different disciplines and knowledge areas in the heterogeneous power-ECS environment. These comprehensive efforts will enable high-volume production of smart and high-voltage silicon-based power electronics, changing the market towards energy-efficient applications to meet the carbon dioxide reduction goals of the European Union. Consequently, economic growth and tackling grand societal challenges such as smart energy and mobility will lead to safeguarding meaningful jobs for European citizens. The most competitive power technology to achieve these goals are IGBTs based on 300 mm silicon wafers, providing maximum performance at best cost-efficiency. Power2Power aims at pushing the frontiers in technology on high-voltage, Si-based IGBTs to new dimensions: -Above 1700 V, with improved power density and with advanced robustness and reliability -Improved power application systems (higher energy efficiency, higher power density) in a broad range of demonstrators -Implementation of the latest knowledge and results of Industry 4.0-aspects along the value chain and in pilot line manufacturing -Power2Power results will be exploited in Europe in large-scale productions: wafer substrate, wafer processing, assembly, packaging and module fabrication as well as in their application domains mobility, industry and grid

Project Details

  • Ongoing
    Call identifier:
    Countries:
    Austria , Switzerland , Germany , Spain , Finland , Hungary , Netherlands , Slovakia
    Coordinating entity:
    Number of participants:
    Total cost:
    -
    Project duration:
    01/06/2019 - ?