Closed Calls
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This page provides an overview of past funding opportunities under the Chips JU, including the Chips for Europe and ECS R&I programmes. While these calls are no longer accepting proposals, you can click on each individual call to review the requirements, submission guidance, and funding structures.
Looking for Results?
These closed calls represent the foundation of active Chips for Europe Initiative actions and ECS projects.
To see active projects: Visit the Chips For Europe Initiative and ECS projects pages.
To prepare for future calls: Connect with potential partners on the ECS Collaboration Tool, the dedicated platform for building project proposals and networking within the European Electronic Components and Systems ecosystem.
Closed calls
Joint call with Korea on Heterogeneous integration and neuromorphic computing technologies for future semiconductor components and systems
Topic code: HORIZON-Chips-2024-3-RIA
This is a co-funded joint initiative with South Korea focusing on neuromorphic computing, advanced packaging, and heterogeneous integration at low TRLs.
Opening Date: 05-02-2024 | Closing Date: 13-05-2024
Indicative EU Budget: 6 M€
Pilot line on Advanced sub 2nm leading-edge system on chip technology
Topic code: Chips-2023-CPL-1
This call establishes a domestic 300mm R&D platform to develop building blocks for sub-2nm system-on-chip technology, accelerating industrialisation for the European semiconductor ecosystem.
Opening Date: 30-11-2023 | Closing Date: 28-02-2024
Indicative EU Budget: Max. €700 Million
Pilot line on Advanced Fully Depleted Silicon On Insulator technologies targeting 7nm
Topic code: Chips-2023-CPL-2
This call aims to develop a pilot line for 10nm and 7nm FD-SOI technology to support ultra-low power and high-performance applications in sectors like automotive and AI.
Opening Date: 30-11-2023 | Closing Date: 28-02-2024
Indicative EU Budget: Max. €420 Million
Pilot line on Advanced Packaging and Heterogenous Integration
Topic code: Chips-2023-CPL-3
This pilot line focuses on developing 2.5D and 3D heterogeneous integration technologies to combine chiplets from different domains into efficient systems-in-package.
Opening Date: 30-11-2023 | Closing Date: 28-02-2024
Indicative EU Budget: Max. €370 Million
Pilot line on Advanced semiconductor devices based on Wide Bandgap materials
Topic code: Chips-2023-CPL-4
This call seeks to extend the maturity of SiC and GaN technologies and explore new wide bandgap materials to support high-efficiency power and radio frequency electronics.
Opening Date: 30-11-2023 | Closing Date: 28-02-2024
Indicative EU Budget: Max. €180 Million
